Faatauva PCB Faumea

tasi itu fa'atofu auro Ceramic Board fa'avae

Fa'amatalaga Puupuu:

Ituaiga mea: fa'avae keramika

Faitauga fa'avae: 1

Ma'i fa'asologa lautele/avanoa: 6 mil

Min pu tele: 1.6mm

Mafiafia laupapa ua mae'a: 1.00mm

Ua mae'a mafiafia apamemea: 35um

Faauma: ENIG

Solder mask lanu: lanumoana

Taimi ta'ita'i: 13 aso


Fa'amatalaga Oloa

Faailoga o oloa

Ituaiga mea: fa'avae keramika

Faitauga fa'avae: 1

Ma'i fa'asologa lautele/avanoa: 6 mil

Min pu tele: 1.6mm

Mafiafia laupapa ua mae'a: 1.00mm

Ua mae'a mafiafia apamemea: 35um

Faauma: ENIG

Solder mask lanu: lanumoana

Taimi ta'ita'i: 13 aso

ceramic based board

Su'ega sima e faasino i pepa apamemea i le vevela maualuga o lo'o fa'apipi'i sa'o i le alumini oxide (Al2O3) po'o le alumini nitride (AlN) sima substrate surface (ta'ito'atasi pe lua) ipu fa'apitoa.O le ultra-thin composite substrate o loʻo i ai le faʻaogaina o le eletise eletise, maualuga le vevela, mea faʻamalo vaivai ma le malosi maualuga, ma e mafai ona faʻapipiʻi ituaiga uma o ata e pei o le PCB laupapa, ma le gafatia tele o le tauaveina.O le mea lea, ua avea substrate sima ma mea faavae o le eletise eletise fausaga fausaga faatekonolosi ma tekinolosi fesootaiga.

Tulaga lelei o laupapa fa'avae sima:

Malosi faʻainisinia faʻamalosi, foliga mautu;Malosi maualuga, maualuga le vevela conductivity, faʻagata maualuga;Malosi pipii, anti - corrosion.

◆ Lelei le faʻatinoga o le taamilosaga vevela, taʻamilosaga taimi e oʻo atu i le 50,000 taimi, maualuga le faʻatuatuaina.

◆ O le fausaga o ata eseese e mafai ona togitogiina e pei o le PCB (poʻo le IMS substrate);Leai se filogia, leai se filogia.

◆ O le vevela o le auaunaga e -55 ℃ ~ 850 ℃;O le faʻalauteleina o le vevela e latalata ile silicon, lea e faʻafaigofie ai le gaosiga o le gaosiga o le eletise.

Le faʻaogaina o laupapa faʻavae keramika:

Sima substrates (alumina, alumini nitride, silicon nitride, zirconia ma zirconia toughening alumina e taʻua o le ZTA) ona o lona lelei sili ona vevela, masini, vailaʻau, ma mea dielectric, e faʻaaogaina lautele i totonu o le pusa vaʻaia semiconductor, sensors, fesoʻotaʻiga eletise, telefoni feʻaveaʻi ma. isi terminal atamai, meafaifaaili ma mita, malosi fou, puna malamalama fou, taavale televave nofoaafi, malosi matagi, robotics, aerospace ma le puipuiga militeli ma isi fanua maualuga-tech .E tusa ai ma fuainumera, o tausaga taʻitasi eseese sima substrate tau oʻo atu i le sefulu piliona o maketi, aemaise lava i tausaga talu ai nei, faatasi ai ma le atinae vave o Saina i taavale malosi fou, nofoaafi maualuga-saosaoa ma 5 g nofoaga faavae, sima substrate manaoga e tele, na o le taavale. eria, o le aofaʻi o manaʻoga i tausaga taʻitasi e oʻo atu i le 5 miliona PCS;Alumina ceramic substrate e le gata e faʻaaogaina lautele i le eletise ma eletise eletise, ae faʻapea foʻi i le masini faʻamalosi ma le faʻaogaina o le vevela.

Fa'aoga ile meli ile vaega e 5 o lo'o mulimuli mai:

1.IGBT module mo nofoaafi televave, taavale malosi fou, gaosiga o le matagi, robots ma nofoaga autu 5G;

2.Smart telefoni backplane ma iloa tamatamailima;

3.New augatupulaga suauu malosi;

4. Fou mafolafola ipu mamafa masini ma le okesene sensor;

5.LD/LED fa'a'avevela vevela, fa'aogaina leisa, hybrid integrated circuit;


  • Muamua:
  • Sosoo ai:

  • Tusi lau savali iinei ma lafo mai ia i matou

    VAEGA O Oloa

    Taulai i le tuuina atu o vaifofo mong pu mo le 5 tausaga.